JPS6328512Y2 - - Google Patents
Info
- Publication number
- JPS6328512Y2 JPS6328512Y2 JP1985085456U JP8545685U JPS6328512Y2 JP S6328512 Y2 JPS6328512 Y2 JP S6328512Y2 JP 1985085456 U JP1985085456 U JP 1985085456U JP 8545685 U JP8545685 U JP 8545685U JP S6328512 Y2 JPS6328512 Y2 JP S6328512Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- winding core
- insulating
- auxiliary electrode
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Fuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8545685U JPS6133353U (ja) | 1985-06-06 | 1985-06-06 | 高圧カツトアウト用限流ヒユ−ズ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8545685U JPS6133353U (ja) | 1985-06-06 | 1985-06-06 | 高圧カツトアウト用限流ヒユ−ズ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6133353U JPS6133353U (ja) | 1986-02-28 |
JPS6328512Y2 true JPS6328512Y2 (en]) | 1988-08-01 |
Family
ID=30635869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8545685U Granted JPS6133353U (ja) | 1985-06-06 | 1985-06-06 | 高圧カツトアウト用限流ヒユ−ズ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6133353U (en]) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6988942B2 (en) | 2000-02-17 | 2006-01-24 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7014538B2 (en) | 1999-05-03 | 2006-03-21 | Applied Materials, Inc. | Article for polishing semiconductor substrates |
US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7207878B2 (en) | 2000-02-17 | 2007-04-24 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0525156Y2 (en]) * | 1987-11-19 | 1993-06-25 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5647886Y2 (en]) * | 1973-02-17 | 1981-11-09 |
-
1985
- 1985-06-06 JP JP8545685U patent/JPS6133353U/ja active Granted
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7014538B2 (en) | 1999-05-03 | 2006-03-21 | Applied Materials, Inc. | Article for polishing semiconductor substrates |
US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7344431B2 (en) | 2000-02-17 | 2008-03-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US7569134B2 (en) | 2000-02-17 | 2009-08-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
US6988942B2 (en) | 2000-02-17 | 2006-01-24 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7285036B2 (en) | 2000-02-17 | 2007-10-23 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical polishing |
US7137868B2 (en) | 2000-02-17 | 2006-11-21 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US7207878B2 (en) | 2000-02-17 | 2007-04-24 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
Also Published As
Publication number | Publication date |
---|---|
JPS6133353U (ja) | 1986-02-28 |
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